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Adhesion Aspects of Thin Films, Volume 3
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Edited by: Mittal, K.L. © 2007 VSP - An imprint of BRILL

 

Description: This book is mostly based on papers presented at the Second International Symposium on this Adhesion Aspects of Thin Films (including Adhesion Measurement and Metallized Plastics) held in Savannah, Georgia.
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Front Matter
Preface
Table of Contents
Part I. Stress and Adhesion Aspects of Thin Films
Expand this node 1. Independent Control of Refractive Index and Internal Stress in Tantalum Oxide Films Deposited by Pulsed and Inductively-Coupled-Plasma Assisted Pulsed Sputtering
Expand this node 2. Stress and Young's Modulus Properties of Some Metallic Thin Films
Expand this node 3. Poly(Tetrafluoroethylene) Thin Films Deposited by Vacuum Evaporation and RF Sputtering
Expand this node 4. Adhesion Layer Effects on the Fabrication of MEMS-Based PZT Devices Deposited on Silicon-Nitride-Coated Substrates
Expand this node 5. Fracture and Adhesion of Thin Films on Ductile Substrates
Expand this node 6. Composition Dependence of the Scratch Resistance of CrNx Coatings on Steel
Expand this node 7. Adhesion Assessment of Ultra-Thin-Plasma-Polymerized Coatings on Stainless-Steel Stents Using the Small-Punch Test
Expand this node 8. Practical Adhesion of Electroless Ni Thin Films on Polymer Surfaces. A Novel Approach Combining Fragmentation Test with Electrical Resistance Measurements
Part II. Metallized Plastics
Expand this node 9. Ni or Cu Electroless Metallization of Polymer Substrates Using Sn-Free or Pd-Free Processes
Expand this node 10. Surface Modification of Micropatterned Poly(Tetrafluoroethylene) Films via Grafting of Viologen for Electroless Metallization
Expand this node 11. Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically-Deposited Copper
Expand this node 12. Aspects of Amino Functionalization of Polypropylene Surfaces for Adhesion Promotion of Thermally-Evaporated Copper Films
Expand this node 13. Plasma Surface Modification of Poly(Oxybenzoate-Co-Oxynaphthoate) (Vecstar®) Films for Copper Metallization
Expand this node 14. Surface Treatment of Plastic Substrates for Improved Adhesion of Thin Metal Films through Ion Bombardment by an Anode Layer Ion Source
Expand this node 15. Tailoring of Thermoplastic Polymer Surfaces with Low Energy Ions: Relevance to Growth and Adhesion of Cu
Expand this node 16. Chemistry at the Cu-Fluoropolymer Interface: Relevance to Adhesion